US 11,943,904 B2
Hybrid thermosyphon with immersion cooled evaporator
Naveenan Thiagarajan, Niskayuna, NY (US); Maja Harfman Todorovic, Niskayuna, NY (US); Anindya Kanti De, Karnataka (IN); and Owen Jannis Samuel Schelenz, Berlin (DE)
Assigned to GE Grid GmbH, Frankfurt Am Main (DE)
Filed by GE Grid GmbH, Frankfurt Am Main (DE)
Filed on May 31, 2022, as Appl. No. 17/828,604.
Prior Publication US 2023/0389242 A1, Nov. 30, 2023
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20936 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling system comprising:
a condenser configured to condense a coolant from a vapor state to a liquid state;
an evaporator configured to evaporate the coolant from the liquid state to the vapor state, said evaporator defining a reservoir configured to contain a volume of the coolant in the liquid state;
a vapor channel fluidly coupled to said condenser and said evaporator and configured to convey the coolant in the vapor state from said evaporator to said condenser;
a liquid channel coupled to said condenser and said evaporator and configured to convey the coolant in the liquid state from said condenser to said evaporator; and
a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state, said heat generating component configured to dissipate heat into the coolant.