US 11,943,902 B2
Circuit structure
Yusuke Isaji, Mie (JP); and Hitoshi Takeda, Mie (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 17/771,660
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Oct. 29, 2020, PCT No. PCT/JP2020/040667
§ 371(c)(1), (2) Date Apr. 25, 2022,
PCT Pub. No. WO2021/090761, PCT Pub. Date May 14, 2021.
Claims priority of application No. 2019-201590 (JP), filed on Nov. 6, 2019.
Prior Publication US 2022/0386456 A1, Dec. 1, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20872 (2013.01) [H05K 7/20927 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A circuit structure comprising:
a heat generating component;
a bus bar connected to a connection portion of the heat generating component;
an insulating base member configured to hold the heat generating component and the bus bar; and
a coolant flow path provided inside the base member and through which a coolant flows,
wherein the bus bar is in thermal contact with the coolant flow path,
the base member includes a passage wall portion constituting the coolant flow path, and the bus bar is brought into thermal contact with the coolant flow path due to a portion of the bus bar being embedded or press-fitted into the passage wall portion, and
the passage wall portion includes a groove through which the coolant flows and a protruding portion that protrudes into the groove, the protruding portion includes a slit-shaped bus bar housing groove that is open in the upper surface thereof that does not face the groove, and the bus bar is press-fitted into the bus bar housing groove.