US 11,943,899 B1
Composite thermal interface materials and associated devices, systems, and methods
Himanshu Pokharna, Saratoga, CA (US)
Assigned to Deeia Inc., Saratoga, CA (US)
Filed by Deeia Inc., Saratoga, CA (US)
Filed on May 19, 2023, as Appl. No. 18/199,881.
Int. Cl. H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/20454 (2013.01) [H01L 23/373 (2013.01); H01L 23/4275 (2013.01); H05K 7/20481 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A heat-transfer component, comprising:
a thermal-interface surface comprising a first region having an outer periphery and a second region surrounding the outer periphery of the first region;
a volume of composite thermal-interface material contained within the outer periphery of the first region, the composite thermal-interface material comprising a silicone oil substrate and a metallic filler, the metallic filler having a solid-to-liquid transition temperature between about 10° C. and about 95° C.; and
a volume of second thermal-interface material within the second region, wherein a composition of the composite thermal-interface material differs from a composition of the second thermal-interface material, wherein the second thermal-interface material is positioned outward of the composite thermal-interface material, defining a gap between the composite thermal-interface material and the second thermal-interface material.