US 11,943,898 B2
Electronic device
Nobuyuki Sugawara, Chiba (JP); and Katsushi Ito, Chiba (JP)
Assigned to Sony Interactive Entertainment Inc., Tokyo (JP)
Appl. No. 17/910,197
Filed by Sony Interactive Entertainment Inc., Tokyo (JP)
PCT Filed Mar. 23, 2021, PCT No. PCT/JP2021/011967
§ 371(c)(1), (2) Date Sep. 8, 2022,
PCT Pub. No. WO2021/193621, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-059185 (JP), filed on Mar. 27, 2020.
Prior Publication US 2023/0097177 A1, Mar. 30, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 7/20336 (2013.01) [H05K 7/2039 (2013.01); H05K 9/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
a circuit board;
a board shield that covers the circuit board and has an opening formed in the board shield; and
a heat radiating device including a plurality of fins that are arranged on an inside of the opening, a heat pipe that includes a connecting portion being located between the plurality of fins and the circuit board and extending in a first direction along the circuit board, and a base plate that supports the plurality of fins, wherein
the base plate includes a first plate portion, and
the first plate portion covers a first surface of the heat pipe, the first surface facing a side of the board shield, and closes a gap between a first end portion of the plurality of fins in the first direction and an edge of the opening of the board shield.