US 11,943,886 B2
Electronic assembly including a compression assembly for cable connector modules
Christopher William Blackburn, Bothell, WA (US); Brian Patrick Costello, Scotts Valley, CA (US); and Alex Michael Sharf, Harrisburg, PA (US)
Assigned to TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen (CH)
Filed by TE Connectivity Services GmbH, Schaffhausen (CH)
Filed on Oct. 25, 2021, as Appl. No. 17/509,574.
Claims priority of provisional application 63/112,481, filed on Nov. 11, 2020.
Prior Publication US 2022/0151095 A1, May 12, 2022
Int. Cl. H05K 7/10 (2006.01); H01R 12/52 (2011.01); H01R 13/11 (2006.01); H01R 13/24 (2006.01); H05K 3/36 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/1084 (2013.01) [H01R 12/52 (2013.01); H01R 13/11 (2013.01); H01R 13/24 (2013.01); H05K 3/368 (2013.01); H05K 7/20409 (2013.01); H05K 7/20509 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10704 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
an electronic package including a package substrate having an upper surface and a lower surface, the electronic package including an integrated circuit component electrically connected to the package substrate, the electronic package includes lower package contacts electrically connected to the integrated circuit component and configured to be electrically connected to a host circuit board, the electronic package includes upper package contacts electrically connected to the integrated circuit component;
interposer assemblies electrically connected to the electronic package, each interposer assembly including an array of interposer contacts, the interposer contacts being compressible, each interposer contact having an upper mating interface and a lower mating interface, the lower mating interfaces of the interposer contacts are mated with the corresponding upper package contacts, the interposer assemblies defining separable interfaces with the electronic package;
cable connector modules coupled to the interposer assemblies, each cable connector module including a cable connector housing holding a connector module substrate, wherein the cable connector module is configured to have a cable communicatively coupled to the connector module substrate and extend from the cable connector housing, the connector module substrate having cable connector module contacts, the cable connector module contacts being mated with the upper mating interfaces of the corresponding interposer contacts;
at least one cover assembly coupled to the upper surface of the electronic package, the cover assembly including a cover having a plate and walls extending from the plate to form at least one connector module cavity configured to receive the corresponding cable connector module, the plate including at least one window associated with the at least one connector module cavity, the cover assembly including at least one bridge assembly received in the corresponding connector module cavity and extending through the corresponding window, each bridge assembly having a plurality of plates arranged in a plate stack, the plates including upper edges and lower edges, the lower edges engaging the cable connector module housing; and
a load plate coupled to the cover assembly, the load plate having a bottom surface engaging the upper edges of the plates of the bridge assemblies, wherein the load plate presses against the plates of the bridge assemblies to drive the bridge assemblies into the cable connector modules, the cable connector modules compressing the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.