US 11,943,874 B2
Stacking arrays and separator bodies during processing of component carriers on array level
Amin Nickkolgh, Tehran (IR); Yu-Hui Wu, Taoyuan (CN); and Ismadi Bin Ismail, Kuching (MY)
Assigned to AT&S (Chongqing) Company Limited, Chongqing (CN)
Filed by AT&S (Chongqing) Company Limited, Chongqing (CN)
Filed on Dec. 11, 2020, as Appl. No. 17/247,456.
Claims priority of application No. 201911325379.2 (CN), filed on Dec. 20, 2019.
Prior Publication US 2021/0195753 A1, Jun. 24, 2021
Int. Cl. H05K 3/00 (2006.01)
CPC H05K 3/007 (2013.01) [H05K 3/0097 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/162 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of processing component carriers, comprising:
providing a plurality of arrays each comprising a plurality of component carriers;
providing a plurality of separator bodies;
forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body; and
carrying out at least one process using the stack,
wherein the separator bodies are separator sheets and the separator sheets have a thickness in a range between 30 μm and 100 μm.