CPC H05K 3/007 (2013.01) [H05K 3/0097 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/162 (2013.01)] | 18 Claims |
1. A method of processing component carriers, comprising:
providing a plurality of arrays each comprising a plurality of component carriers;
providing a plurality of separator bodies;
forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body; and
carrying out at least one process using the stack,
wherein the separator bodies are separator sheets and the separator sheets have a thickness in a range between 30 μm and 100 μm.
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