US 11,943,871 B2
Component mounter
Yukinori Nakayama, Hekinan (JP)
Assigned to FUJI CORPORATION, Chiryu (JP)
Appl. No. 17/430,359
Filed by FUJI CORPORATION, Chiryu (JP)
PCT Filed Feb. 14, 2019, PCT No. PCT/JP2019/005273
§ 371(c)(1), (2) Date Aug. 12, 2021,
PCT Pub. No. WO2020/165993, PCT Pub. Date Aug. 20, 2020.
Prior Publication US 2022/0132712 A1, Apr. 28, 2022
Int. Cl. H05K 13/00 (2006.01); H05K 13/04 (2006.01)
CPC H05K 13/0409 (2018.08) [H05K 13/041 (2018.08); H05K 13/0413 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A component mounter for mounting electronic components, comprising:
a mounting head including multiple suction nozzles configured to pick up and mount the electronic components on a circuit board, at least two suction nozzles of the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously;
a pallet configured to hold multiple trays, the trays configured to hold the electronic components; and
a control device configured to perform an electronic component pickup operation step that includes
moving the mounting head to a position,
lowering simultaneously the at least two suction nozzles to be located individually on at least two trays on the pallet, and
picking up the electronic components simultaneously on the at least two trays.