US 11,943,869 B2
Electrically functional circuit board core material
Brandon Summey, Simpsonville, SC (US); Peter A. Blais, Simpsonville, SC (US); Robert Andrew Ramsbottom, Simpsonville, SC (US); Jeffrey Poltorak, Simpsonville, SC (US); and Courtney Elliott, San Jose, CA (US)
Assigned to KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed by KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed on Feb. 1, 2021, as Appl. No. 17/163,648.
Claims priority of provisional application 62/969,884, filed on Feb. 4, 2020.
Prior Publication US 2021/0243897 A1, Aug. 5, 2021
Int. Cl. H05K 1/11 (2006.01); H01G 9/045 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/185 (2013.01) [H01G 9/045 (2013.01); H05K 1/0393 (2013.01); H05K 3/30 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10015 (2013.01)] 48 Claims
OG exemplary drawing
 
1. A circuit board core material comprising:
a laminate comprising:
a resin or resin-glass prepreg layer;
a first clad layer directly on a first side of said prepreg layer wherein said prepreg layer comprises a pocket; and
a capacitor in said pocket wherein said capacitor comprises a porous valve metal and said capacitor comprises a first external termination and a second external termination wherein said first external termination is laminated to and in electrical contact with said first clad layer and said second external termination is laminated to and in electrical contact with a conductor;
wherein said first external termination is a counter electrode and further comprising a conductive paint on said counter electrode; and
further comprising a cathode isolation region.