CPC H05B 3/283 (2013.01) [C04B 35/581 (2013.01); C04B 37/023 (2013.01); H05B 1/0233 (2013.01); H05B 3/12 (2013.01); B23K 20/02 (2013.01); B23K 2101/40 (2018.08); B23K 2103/10 (2018.08); B23K 2103/18 (2018.08); C04B 2237/122 (2013.01); C04B 2237/16 (2013.01); C04B 2237/366 (2013.01); C04B 2237/62 (2013.01); H01L 21/67103 (2013.01); H05B 2203/005 (2013.01); H05B 2203/016 (2013.01); H05B 2203/017 (2013.01)] | 21 Claims |
1. A heater comprising:
a ceramic substrate;
a heating layer, wherein the heating layer is bonded to the ceramic substrate via transient liquid phase bonding;
a routing layer, wherein the routing layer extends radially between a central portion of the ceramic substrate and an outer portion of the ceramic substrate, and wherein the routing layer is disposed within the ceramic substrate; a plurality of first conductive vias connecting the heating layer to the routing layer; and
a plurality of second conductive vias connecting the routing layer to at least one terminal wire, the terminal wire being disposed proximate the central portion of the ceramic substrate,
wherein the routing layer is bonded to the ceramic substrate via transient liquid phase bonding.
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