US 11,943,589 B2
Shielded hearing device components and related methods
Thorvaldur Oli Bodvarsson, Ballerup (DK); Kamila Piotrowska, Ballerup (DK); and Prasong Thongkhan, Ballerup (DK)
Assigned to GN HEARING A/S, Ballerup (DK)
Filed by GN Hearing A/S, Ballerup (DK)
Filed on Oct. 11, 2021, as Appl. No. 17/498,519.
Claims priority of application No. PA202070701 (DK), filed on Oct. 23, 2020.
Prior Publication US 2022/0132257 A1, Apr. 28, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 25/00 (2006.01); H05K 3/28 (2006.01); H05K 9/00 (2006.01)
CPC H04R 25/609 (2019.05) [H04R 25/65 (2013.01); H05K 3/284 (2013.01); H05K 9/0024 (2013.01); H05K 2203/1322 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic circuit of an audio device, the method comprising:
providing a body, the body comprising a circuit board and one or more components including a first component mounted on the circuit board;
applying a first insulation layer;
applying a second insulation layer; and
applying one or more shielding layers including a first shielding layer covering at least a part of the second insulation layer;
wherein the first shielding layer comprises a periphery part that is applied to surround at least a lower part of one of the one or more components, wherein the periphery part of the first shielding layer is applied after the first insulation layer and the second insulation layer are applied.
 
8. An electronic circuit for an audio device, the electronic circuit comprising:
a circuit board; and
one or more components including a first component mounted on the circuit board;
a first shielding layer;
a first insulation layer; and
a second insulation layer, the second insulation layer being between the first insulation layer and the first shielding layer;
wherein the circuit board comprises a first surface and a second surface opposite from the first surface, wherein the circuit board comprises a ground pad element located closer to the first surface of the circuit board than to the second surface of the circuit board, and wherein the first shielding layer is in contact with the ground pad element that is closer to the first surface of the circuit board than to the second surface of the circuit board.
 
17. A method of manufacturing an electronic circuit of an audio device, the method comprising:
providing a body, the body comprising a circuit board and one or more components including a first component mounted on the circuit board;
applying a first insulation layer so that the first insulation layer is in contact with the first component;
applying a second insulation layer so that the second insulation layer is in contact with the first component; and
applying one or more shielding layers including a first shielding layer above at least a part of the second insulation layer;
wherein a material composition of the first insulation layer and a material composition of the second insulation layer are the same.