CPC H04N 23/55 (2023.01) [G02B 23/2484 (2013.01); H01L 27/1462 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H04N 23/54 (2023.01); A61B 1/0011 (2013.01); H04N 23/555 (2023.01)] | 16 Claims |
1. A manufacturing method of an image pickup apparatus for use with an endoscope, the manufacturing method comprising:
measuring a position of an image-forming plane on which an object image, light of which is focused by an optical member having a plurality of stacked optical devices, is formed;
stacking the optical member and an image pickup sensor having a light receiving surface in an optical axis direction such that a space having a first thickness in the optical axis direction is provided between the optical member and the light receiving surface;
applying an uncured transparent resin to the space to provide an uncured transparent resin layer having the first thickness;
adjusting the first thickness to a second thickness, different from the first thickness, so that the light receiving surface is positioned at the measured image-forming plane; and
subsequent to the adjusting, curing the uncured transparent resin layer to fix the optical member and the light receiving surface separated by the second thickness.
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