US 11,943,522 B2
Manufacturing method of image pickup apparatus for endoscope, image pickup apparatus for endoscope, and endoscope
Jumpei Yoneyama, Nagano (JP)
Assigned to OLYMPUS CORPORATION, Tokyo (JP)
Filed by OLYMPUS CORPORATION, Tokyo (JP)
Filed on Jul. 14, 2021, as Appl. No. 17/375,174.
Application 17/375,174 is a continuation of application No. PCT/JP2019/001257, filed on Jan. 17, 2019.
Prior Publication US 2021/0344822 A1, Nov. 4, 2021
Int. Cl. H04N 23/55 (2023.01); A61B 1/00 (2006.01); G02B 23/24 (2006.01); H01L 27/146 (2006.01); H04N 23/50 (2023.01); H04N 23/54 (2023.01)
CPC H04N 23/55 (2023.01) [G02B 23/2484 (2013.01); H01L 27/1462 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H04N 23/54 (2023.01); A61B 1/0011 (2013.01); H04N 23/555 (2023.01)] 16 Claims
OG exemplary drawing
 
1. A manufacturing method of an image pickup apparatus for use with an endoscope, the manufacturing method comprising:
measuring a position of an image-forming plane on which an object image, light of which is focused by an optical member having a plurality of stacked optical devices, is formed;
stacking the optical member and an image pickup sensor having a light receiving surface in an optical axis direction such that a space having a first thickness in the optical axis direction is provided between the optical member and the light receiving surface;
applying an uncured transparent resin to the space to provide an uncured transparent resin layer having the first thickness;
adjusting the first thickness to a second thickness, different from the first thickness, so that the light receiving surface is positioned at the measured image-forming plane; and
subsequent to the adjusting, curing the uncured transparent resin layer to fix the optical member and the light receiving surface separated by the second thickness.