US 11,942,878 B2
Microstructured field effect device
Lukas Bluecher, Eurasburg (DE); and Michael Milbocker, Holliston, MA (US)
Assigned to BVW Holding AG, Cham (CH)
Filed by BVW Holding AG, Cham (CH)
Filed on Apr. 1, 2020, as Appl. No. 16/837,819.
Prior Publication US 2021/0307891 A1, Oct. 7, 2021
Int. Cl. H02N 13/00 (2006.01); A61F 2/02 (2006.01); A61F 2/00 (2006.01); A61F 2/48 (2006.01)
CPC H02N 13/00 (2013.01) [A61F 2/02 (2013.01); A61F 2002/0086 (2013.01); A61F 2/482 (2021.08)] 18 Claims
OG exemplary drawing
 
1. An electro-microstructured device comprising:
a substrate having a hierarchical microstructure disposed thereon, the substrate having a thickness;
the hierarchical microstructure having a first microfeature, the first microfeature having a surface wherein a plurality of second microfeatures are disposed about the surface of the first microfeature; and
a first electrode and a second electrode, the first electrode and second electrode at least partially embedded within the thickness of the substrate and connected to a charge source, wherein the first electrode is configured to provide a positive charge of about +0.5V and the second electrode is configured to provide a negative charge of about −0.5V when powered by the charge source, and wherein charging the first electrode and second electrode generates an electroadhesive state via Wenzel-Cassie wetting domains.