US 11,942,708 B2
Crimp terminal-equipped flexible printed circuit board and method for manufacturing same
Masanori Hirata, Tokyo (JP); Shunsuke Aoyama, Tokyo (JP); Yu Miura, Tokyo (JP); and Kenji Kiya, Tokyo (JP)
Assigned to NIPPON MEKTRON, LTD., Tokyo (JP)
Filed by NIPPON MEKTRON, LTD., Tokyo (JP)
Filed on Nov. 15, 2021, as Appl. No. 17/454,948.
Claims priority of application No. 2021-038017 (JP), filed on Mar. 10, 2021.
Prior Publication US 2022/0294135 A1, Sep. 15, 2022
Int. Cl. H01R 12/69 (2011.01); H01R 43/048 (2006.01); H05K 1/18 (2006.01)
CPC H01R 12/69 (2013.01) [H01R 43/048 (2013.01); H05K 1/189 (2013.01); H05K 2201/10333 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/2009 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A crimp terminal-equipped flexible printed circuit board comprising:
a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil;
crimp terminals including multiple crimp pieces crimped to penetrate the first flexible printed circuit board in a thickness direction of the first flexible printed circuit board and bent to bite into part of the circuit; and
an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate, wherein
the multiple crimp pieces penetrate the insulating reinforcing film in the thickness direction.