US 11,942,589 B2
Managing thermal resistance and planarity of a display package
Rajendra D. Pendse, Fremont, CA (US)
Assigned to META PLATFORMS TECHNOLOGIES, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed on May 12, 2022, as Appl. No. 17/742,809.
Application 17/742,809 is a continuation of application No. 16/834,605, filed on Mar. 30, 2020, granted, now 11,362,251.
Claims priority of provisional application 62/942,319, filed on Dec. 2, 2019.
Prior Publication US 2022/0285601 A1, Sep. 8, 2022
Int. Cl. H01L 33/64 (2010.01); G02B 27/01 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01)
CPC H01L 33/644 (2013.01) [G02B 27/017 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a display package comprising a molding compound, a backplane die, and at least one spacer structure, wherein the backplane die and the at least one spacer structure are embedded within the molding compound; and
a plurality of light emitting diode (LED) dies arranged on a top surface of the display package, the plurality of LED dies including a first die containing an array of red LEDs, a second die containing an array of green LEDs, and a third die containing an array of blue LEDs, wherein:
the first die, the second die, and the third die are individually mounted and spaced apart on the top surface of the display package,
the backplane die includes driver circuits configured to drive LEDs of the first die, the second die, and the third die, and
the at least one spacer structure has a higher thermal conductivity than the molding compound and is configured to dissipate heat generated by the LEDs of the first die, the second die, and the third die.