US 11,942,582 B2
Light-emitting module and method of manufacturing the same
Saiki Yamamoto, Tokushima (JP); and Shinya Matsuoka, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Nov. 30, 2022, as Appl. No. 18/072,552.
Application 18/072,552 is a continuation of application No. 16/843,884, filed on Apr. 9, 2020, granted, now 11,545,603.
Claims priority of application No. 2019-082309 (JP), filed on Apr. 23, 2019.
Prior Publication US 2023/0094131 A1, Mar. 30, 2023
Int. Cl. H01L 33/58 (2010.01); H01L 25/16 (2023.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01)
CPC H01L 33/58 (2013.01) [H01L 25/165 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A light-emitting module comprising:
a substrate;
a light-emitting device disposed on the substrate, the light-emitting device comprising at least one light-emitting element and a light-transmissive member disposed on a light extraction surface of the at least one light-emitting element;
a lens disposed apart from the light-emitting device at a position where the lens faces the light-emitting device;
an optical sensor having an upper surface including a light-receiving surface to receive light through the lens and is disposed on the substrate at a position where at least a part of the light-receiving surface faces the lens; and
a covering member which contains a coloring agent and covers the light-receiving surface with a constant thickness, wherein
a center of the light-emitting device is located at a center of the lens in a plan view.