US 11,942,580 B2
Compact opto-electronic modules and fabrication methods for such modules
Simon Gubser, Weesen (CH); Mario Cesana, Au (CH); Markus Rossi, Jona (CH); and Hartmut Rudmann, Jona (CH)
Assigned to ams Sensors Singapore Pte. Ltd., Singapore (SG)
Filed by ams Sensors Singapore Pte. Ltd., Singapore (SG)
Filed on Oct. 11, 2021, as Appl. No. 17/498,105.
Application 17/498,105 is a continuation of application No. 16/919,556, filed on Jul. 2, 2020, granted, now 11,145,796.
Application 16/919,556 is a continuation of application No. 15/473,935, filed on Mar. 30, 2017, granted, now 10,741,736, issued on Aug. 11, 2020.
Application 15/473,935 is a continuation of application No. 14/917,104, granted, now 9,640,709, issued on May 2, 2017, previously published as PCT/SG2014/000390, filed on Aug. 20, 2014.
Claims priority of provisional application 61/903,516, filed on Nov. 13, 2013.
Claims priority of provisional application 61/876,066, filed on Sep. 10, 2013.
Prior Publication US 2022/0028908 A1, Jan. 27, 2022
Int. Cl. H01L 33/56 (2010.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01S 5/02 (2006.01); H01S 5/183 (2006.01); H10K 50/84 (2023.01); H10K 50/858 (2023.01); H10K 71/00 (2023.01)
CPC H01L 33/56 (2013.01) [H01L 24/97 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H01L 31/0203 (2013.01); H01L 31/02164 (2013.01); H01L 31/02327 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01S 5/02 (2013.01); H01S 5/183 (2013.01); H10K 50/84 (2023.02); H10K 50/858 (2023.02); H10K 71/00 (2023.02); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An optoelectronic module comprising:
an optoelectronic device mounted on a substrate;
a transparent overmold laterally surrounding sides of the optoelectronic device and covering a top surface of the optoelectronic device, wherein the transparent overmold is in direct contact with the optoelectronic device, wherein the top surface of the transparent overmold is slanted with respect to a plane of the substrate on which the optoelectronic device is mounted;
a passive optical element on a top surface of the transparent overmold, wherein the passive optical element is transparent; and
sidewalls laterally surrounding the optoelectronic device and in direct contact with sides of the transparent overmold.