US 11,942,563 B1
Manufacturing method of chip package and chip package
Chia-Sheng Lin, Taoyuan (TW); Hui-Hsien Wu, Taoyuan (TW); Jian-Hong Chen, Taoyuan (TW); Tsang-Yu Liu, Zhubei (TW); and Kuei-Wei Chen, Taoyuan (TW)
Assigned to XINTEC INC., Taoyuan (TW)
Filed by XINTEC INC., Taoyuan (TW)
Filed on Jun. 1, 2023, as Appl. No. 18/327,875.
Application 18/327,875 is a division of application No. 17/373,773, filed on Jul. 13, 2021, granted, now 11,705,368, issued on Jul. 18, 2023.
Application 17/373,773 is a division of application No. 16/668,570, filed on Oct. 30, 2019, granted, now 11,121,031, issued on Sep. 14, 2021.
Claims priority of provisional application 62/900,949, filed on Sep. 16, 2019.
Claims priority of provisional application 62/754,349, filed on Nov. 1, 2018.
Int. Cl. H01L 31/0352 (2006.01); H01L 31/02 (2006.01)
CPC H01L 31/03529 (2013.01) [H01L 31/02005 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A chip package, comprising:
a chip having a conductive pad, an opening defining a sensing area, an inner wall surface surrounding the opening, and an outer wall surface facing away from the inner wall surface;
a carrier; and
a light-transmissive function layer located between the chip and the carrier, wherein a first portion of the light-transmissive function layer is located in the opening, a second portion of the light-transmissive function layer is covered by the chip, a third portion of the light-transmissive function layer protrudes from the outer wall surface of the chip, and the conductive pad is located on the third portion, wherein a first included angle is formed between the outer wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and a second included angle is formed between the inner wall surface and the surface of the chip facing the light-transmissive function layer, and the first included angle is different from the second included angle.