US 11,942,504 B2
Stack chip air gap heat insulator
Sing-Chung Hu, San Jose, CA (US)
Assigned to OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US)
Filed by OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US)
Filed on Aug. 15, 2022, as Appl. No. 17/819,821.
Application 17/819,821 is a division of application No. 16/597,762, filed on Oct. 9, 2019, granted, now 11,456,328.
Prior Publication US 2022/0392943 A1, Dec. 8, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 23/467 (2006.01); H01L 31/024 (2014.01)
CPC H01L 27/14636 (2013.01) [H01L 23/467 (2013.01); H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); H01L 31/024 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An image sensor, comprising:
a logic die, comprising:
a function logic element disposed on a bond side of the logic die; and
a logic oxide array of raised logic oxide features disposed on the bond side of the logic die;
a pixel die that is stacked on top of the logic die, the pixel die comprising:
a pixel array disposed on a light receiving side of the pixel die; and
a pixel oxide array of raised pixel oxide features disposed on a bond side of the pixel die;
a plurality of outer bonds disposed between an outer region of the logic die and an outer region of the pixel die; and
a plurality of inner bonds formed at an inner region of the image sensor between the pixel oxide array and the logic oxide array, the inner bonds being spaced apart by a plurality of fluidly connected air gaps extending between the logic die and the pixel die,
wherein the raised logic oxide features comprise a plurality of logic oxide stripes and the raised pixel oxide features comprise a plurality of pixel oxide stripes, wherein no logic oxide stripe extends in the same direction as any pixel oxide stripe.