CPC H01L 27/14618 (2013.01) | 32 Claims |
1. A digital image sensor package, comprising:
an image sensor substrate carrying photodiodes; and
a glass covering having a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering, wherein the glass covering is monolithic and overlies all of the photodiodes;
wherein a surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to one or both of the top and bottom surfaces of the glass; and
wherein a surface area of a top surface of the image sensor substrate is greater than the surface area of the bottom surface of the glass covering.
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