US 11,942,496 B2
Slanted glass edge for image sensor package
Laurent Herard, Singapore (SG); and David Gani, Singapore (SG)
Assigned to STMicroelectronics Pte Ltd, Singapore (SG)
Filed by STMicroelectronics Pte Ltd, Singapore (SG)
Filed on May 21, 2021, as Appl. No. 17/326,537.
Claims priority of provisional application 63/034,464, filed on Jun. 4, 2020.
Prior Publication US 2021/0384241 A1, Dec. 9, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14618 (2013.01) 32 Claims
OG exemplary drawing
 
1. A digital image sensor package, comprising:
an image sensor substrate carrying photodiodes; and
a glass covering having a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering, wherein the glass covering is monolithic and overlies all of the photodiodes;
wherein a surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to one or both of the top and bottom surfaces of the glass; and
wherein a surface area of a top surface of the image sensor substrate is greater than the surface area of the bottom surface of the glass covering.