US 11,942,453 B2
Thermal management of three-dimensional integrated circuits
Kambiz Vafai, Mission Viejo, CA (US); Andisheh Tavakoli, Irvine, CA (US); and Mohammad Reza Salimpour, Irvine, CA (US)
Assigned to Kambix Innovations, LLC, Albuquerque, NM (US)
Filed by KAMBIX INNOVATIONS, LLC, Albuquerque, NM (US)
Filed on Aug. 13, 2021, as Appl. No. 17/401,676.
Claims priority of provisional application 63/229,826, filed on Aug. 5, 2021.
Prior Publication US 2023/0048534 A1, Feb. 16, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/367 (2006.01); H01L 23/46 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/3672 (2013.01); H01L 23/46 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06589 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A 3D integrated circuit device, comprising:
a substrate;
an electronic device configured above the substrate;
a heat spreader located proximate to the electronic device, the heat spreader comprising a plurality of inserts arranged in a ring configuration, the plurality of inserts having a geometry that is ring shaped and blade shaped and subject to at least one level of pairing; and
a heat sink located above and adjacent to the heat spreader.