US 11,942,438 B2
Electronic component, multiplexer, and module
Motoi Yamauchi, Tokyo (JP); and Masato Ito, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Feb. 16, 2021, as Appl. No. 17/176,804.
Claims priority of application No. 2020-045802 (JP), filed on Mar. 16, 2020.
Prior Publication US 2021/0288001 A1, Sep. 16, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H03H 9/05 (2006.01); H10N 30/88 (2023.01)
CPC H01L 23/562 (2013.01) [H01L 23/02 (2013.01); H01L 23/31 (2013.01); H03H 9/0571 (2013.01); H03H 9/0576 (2013.01); H10N 30/88 (2023.02); H01L 23/498 (2013.01); H01L 23/49805 (2013.01); H01L 23/49838 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a first substrate having a substantially quadrangular planar shape and having a first surface and a second surface, the first surface and the second surface being opposite to each other;
an element disposed on the first surface;
four first terminals located adjacent to four corners on the second surface, respectively; and
a second terminal located between the first terminals at respective ends of each of two sides opposite to each other of the second surface, an area of the second terminal being smaller than an area of each of the first terminals at the respective ends of each of the two sides, a width of the second terminal in an extension direction in which each of the two sides extends being equal to or less than a width of each of the first terminals at the respective ends of each of the two sides in the extension direction.