US 11,942,437 B2
Semiconductor package including an electromagnetic shield and method of fabricating the same
Youngwoo Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 31, 2023, as Appl. No. 18/194,381.
Application 18/194,381 is a continuation of application No. 17/453,225, filed on Nov. 2, 2021, granted, now 11,621,233.
Application 17/453,225 is a continuation of application No. 16/711,065, filed on Dec. 11, 2019, granted, now 11,183,466, issued on Nov. 23, 2021.
Claims priority of application No. 10-2019-0062815 (KR), filed on May 28, 2019.
Prior Publication US 2023/0245981 A1, Aug. 3, 2023
Int. Cl. H01L 23/52 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of fabricating a semiconductor package, the method comprising:
forming an electromagnetic shield that at least partially covers and contacts an upper surface and side surfaces of the semiconductor chip;
forming a molding that at least partially covers the electromagnetic shield; and
electrically connecting the electromagnetic shield to a conductor;
wherein the molding is spaced apart from the semiconductor chip with the electromagnetic shield interposed therebetween.