US 11,942,432 B2
Method for packaging COF
Yaoxin Xi, Suzhou (CN)
Assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED, Suzhou (CN)
Appl. No. 17/615,797
Filed by CHIPMORE TECHNOLOGY CORPORATION LIMITED, Suzhou (CN)
PCT Filed Oct. 13, 2020, PCT No. PCT/CN2020/120535
§ 371(c)(1), (2) Date Dec. 1, 2021,
PCT Pub. No. WO2021/082898, PCT Pub. Date May 6, 2021.
Claims priority of application No. 201911038471.0 (CN), filed on Oct. 29, 2019.
Prior Publication US 2022/0319997 A1, Oct. 6, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/5387 (2013.01) [H01L 23/4985 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for packaging a COF, comprising:
S1, providing a flexible circuit substrate to be packaged and forming a plurality of first pins on a circuit surface of the flexible circuit substrate, and providing a chip to be packaged and forming a plurality of second pins on the chip to be packaged;
S2, arranging to keep the circuit surface of the flexible circuit substrate always facing downwards, arranging to keep a surface of the chip to be packaged, where the second pins matching the first pins are arranged, always facing upwards, and arranging the first pins on the flexible circuit substrate and the second pins on the chip to be packaged, both of which are matched with each other, to be opposite to each other; and
S3, applying a top-down pressure to the flexible circuit substrate and/or applying a bottom-up pressure to the chip to be packaged, and simultaneously heating at high temperature to solder the first pins and the second pins in a fused eutectic manner.