CPC H01L 23/5227 (2013.01) [H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01L 23/5283 (2013.01)] | 20 Claims |
1. A structure comprising: a plurality of wiring levels each of which comprise a wiring structure connected in series to one another, a second wiring level being located above a first wiring level of the plurality of wiring levels, and a wiring structure of the second wiring level being at least partially outside boundaries of the wiring structure of the first wiring level, wherein a top portion of a wiring structure of the first wiring level is in direct physical contact with a bottom surface of the wiring structure of the second wiring level.
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