CPC H01L 23/345 (2013.01) [G01K 7/021 (2013.01); H01L 23/5226 (2013.01)] | 16 Claims |
1. A semiconductor structure comprising:
a heating element located beneath a temperature-controlled region of a chip; and
a thermocouple, wherein the heating element is located between the temperature-controlled region and the thermocouple.
|