US 11,942,386 B2
Electronic devices in semiconductor package cavities
Christopher Daniel Manack, Flower Mound, TX (US); Patrick Francis Thompson, Allen, TX (US); and Qiao Chen, Flower Mound, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Aug. 24, 2020, as Appl. No. 17/001,429.
Prior Publication US 2022/0059423 A1, Feb. 24, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/315 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/49513 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/024 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73207 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/19104 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor package including a mold compound covering a semiconductor die, the semiconductor package having a surface and a cavity in the surface, the semiconductor die having a device side facing the cavity, the device side having circuitry therein; and
an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound, the conductive terminal having a first end physically contacting the device side and a second end extending into the cavity, and wherein the conductive terminal comprises a copper post, and wherein the electronic device includes another semiconductor die.