US 11,942,385 B2
Semiconductor package structure
Sheng-Yu Chen, Kaohsiung (TW); Chang-Lin Yeh, Kaohsiung (TW); and Ming-Hung Chen, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Mar. 29, 2022, as Appl. No. 17/707,803.
Application 17/707,803 is a continuation of application No. 16/725,307, filed on Dec. 23, 2019, granted, now 11,289,394.
Prior Publication US 2022/0223489 A1, Jul. 14, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3135 (2013.01) [H01L 21/565 (2013.01); H01L 23/291 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 23/5387 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/351 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a substrate having a first side and a second side opposite to the first side;
a first semiconductor die disposed on the first side of the substrate;
a second semiconductor die disposed on the second side of the substrate;
a first compound encapsulating the first semiconductor die;
a second compound encapsulating the second semiconductor die; and
a display disposed over a first side of the substrate and electrically connected to the first semiconductor dies, wherein the display is laterally encapsulated by the first compound, and wherein a top surface of the display is at least partially exposed from the first compound.