US 11,942,352 B2
Manufacturing method of LED display
Dahl Young Khang, Seoul (KR); and Byong Joo Lee, Goyang-si (KR)
Assigned to INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, Seoul (KR)
Filed by INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, Seoul (KR)
Filed on Aug. 31, 2021, as Appl. No. 17/462,219.
Claims priority of application No. 10-2020-0109942 (KR), filed on Aug. 31, 2020; and application No. 10-2021-0108298 (KR), filed on Aug. 17, 2021.
Prior Publication US 2022/0068693 A1, Mar. 3, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01)
CPC H01L 21/6835 (2013.01) [H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2933/0066 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for manufacturing an LED display, comprising:
picking up a plurality of LED chips spaced apart at a first interval with a stretchable stamp;
spacing apart the plurality of LED chips at a second interval by stretching the stretchable stamp; and
transferring the plurality of LED chips to a target substrate,
using a plurality of pick-up pillars comprising a cylinder portion connected to the body and a top portion having a larger cross-sectional area than the cylinder portion on the upper surface of the cylinder portion,
wherein the cross-sectional area ratio of the cylinder portion and the top portion is 100:130 to 100:300, and
wherein the cylinder portion and the top portion each have a columnar shape.