US 11,942,350 B2
Electrostatic chuck and substrate holding device
Masakuni Miyazawa, Nagano (JP); Mizuki Watanabe, Nagano (JP); and Tomohiro Inoue, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Dec. 22, 2021, as Appl. No. 17/645,521.
Claims priority of application No. 2021-126602 (JP), filed on Aug. 2, 2021.
Prior Publication US 2023/0032111 A1, Feb. 2, 2023
Int. Cl. H01L 21/683 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32715 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electrostatic chuck comprising:
a base having a surface on which an object is to be placed; and
a through hole extending through the base,
wherein a porous material containing angular ceramic particles is disposed in the through hole, and
wherein the porous material includes oxides of two or more elements in addition to the angular ceramic particles, the oxides of two or more elements adhering to a portion of an outer surface of the angular ceramic particles to support the angular ceramic particles, and the oxides of two or more elements bonding and integrating the angular ceramic particles.