US 11,942,346 B2
Resin applying machine
Yoshikuni Migiyama, Tokyo (JP); Kazuki Sugiura, Tokyo (JP); Yoshinori Kakinuma, Tokyo (JP); and Mitsuru Ikushima, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Jul. 14, 2020, as Appl. No. 16/928,432.
Claims priority of application No. 2019-135644 (JP), filed on Jul. 23, 2019.
Prior Publication US 2021/0028026 A1, Jan. 28, 2021
Int. Cl. H01L 21/67 (2006.01); B05C 11/10 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/673 (2013.01) [B05C 11/1005 (2013.01); B05C 11/1015 (2013.01); H01L 21/67248 (2013.01); H01L 21/6776 (2013.01); H01L 21/6835 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A resin applying machine for coating a surface of a wafer with a resin to a desired thickness, comprising:
a processing chamber housing therein
a holder for holding the wafer,
a table that faces the holder,
a resin supply unit for supplying a liquid resin to the table,
a moving unit for relatively moving the holder and the table closely to each other, and
a hardening unit for hardening the liquid resin that has coated the wafer;
a temperature measuring unit for measuring a temperature in the processing chamber, the temperature measuring unit including a first temperature measuring device that measures a temperature of holder and a second temperature measuring device that measures a temperature of the table, wherein the temperature in the processing chamber is based on the temperature measured by the first temperature measuring device and the temperature measured by the second temperature measuring device; and
a controller configured for controlling the moving unit and the temperature measuring unit,
wherein the controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature, as data for making the resin thickness of the resin that has coated the wafer constant even at different temperatures in the processing chamber, the data being acquired on a basis of measured resin thicknesses of the resin that has coated the wafer when the moving unit has relatively moved the holder and the table by the same moved distance at different temperatures in the processing chamber,
the controller is configured to set the moved distance corresponding to the temperature measured by the temperature measuring unit in the moving unit by referring to the correlation data and coats the wafer with the resin to a predetermined resin thickness.