US 11,942,345 B2
Automated substrate placement to chamber center
Wolfgang Aderhold, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 15, 2022, as Appl. No. 17/866,315.
Prior Publication US 2024/0021451 A1, Jan. 18, 2024
Int. Cl. H01L 21/67 (2006.01); B25J 11/00 (2006.01); G05B 19/00 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67259 (2013.01) [B25J 11/0095 (2013.01); G05B 19/00 (2013.01); G05B 2219/00 (2013.01); H01L 21/68707 (2013.01)] 20 Claims
OG exemplary drawing
 
18. A semiconductor processing tool, comprising:
a chamber;
a plurality of pyrometers arranged about a bottom or top surface of the chamber;
a plurality of lamps opposite from the plurality of pyrometers;
a robot arm for inserting substrates into the chamber, wherein the robot arm is displaceable in a first direction and a second direction orthogonal to the first direction; and
a processor, wherein the processor includes instructions for centering substrates in the chamber using readings from the plurality of pyrometers, wherein centering substrates in the chamber is done without opening the chamber.