CPC H01L 21/67248 (2013.01) [G01J 5/00 (2013.01); G01K 13/00 (2013.01); H01L 21/67103 (2013.01)] | 19 Claims |
1. A method of determining a critical temperature of a semiconductor package, the method comprising:
applying heat to the semiconductor package;
measuring successive temperatures of the semiconductor package during the applying of the heat by operating an actuator configured to move a temperature sensor along a first horizontal direction and a second horizontal direction substantially perpendicular to the first horizontal direction;
measuring heights of the semiconductor package at each of the successive temperatures during the applying of the heat; and
determining a temperature, as the critical temperature of the semiconductor package, from among the measured temperatures of the semiconductor package at a point at which a height of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs.
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