US 11,942,336 B2
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
Taejin Choi, Yongin-si (KR); Chunggu Lee, Yongin-si (KR); Sooin Park, Yongin-si (KR); and Jungjin Lee, Yongin-si (KR)
Assigned to DOOSAN CORPORATION, Seoul (KR)
Filed by DOOSAN CORPORATION, Seoul (KR)
Filed on Aug. 17, 2021, as Appl. No. 17/404,009.
Claims priority of application No. 10-2020-0182150 (KR), filed on Dec. 23, 2020.
Prior Publication US 2022/0199430 A1, Jun. 23, 2022
Int. Cl. H01L 21/56 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/563 (2013.01) [C09J 7/38 (2018.01); C09J 7/405 (2018.01); C09J 163/00 (2013.01); H01L 24/92 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); H01L 2224/92125 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An underfill film for semiconductor packages, comprising:
a base; and
an adhesive layer disposed on one surface of the base, having a melt viscosity in a range of 300 to 1000 Pa·s at 150 to 160° C., and having an onset temperature of 145±5° C. on a differential scanning calorimeter (DSC),
wherein the adhesive layer is a cured product or a semi-cured product of an adhesive resin composition, the adhesive resin composition comprising:
(a) an epoxy resin containing a liquid epoxy resin, a phenoxy resin and a polyfunctional epoxy resin;
(b) an acid anhydride curing agent;
(c) a nitrogen (N)-containing heterocyclic compound; and
(d) a filler.