US 11,942,335 B2
Manufacturing a module with solder body having elevated edge
Achim Muecke, Erwitte (DE); and Arthur Unrau, Geseke (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Nov. 17, 2022, as Appl. No. 17/989,196.
Application 17/989,196 is a continuation of application No. 16/951,633, filed on Nov. 18, 2020, granted, now 11,538,694.
Claims priority of application No. 10 2019 132 332.0 (DE), filed on Nov. 28, 2019.
Prior Publication US 2023/0080004 A1, Mar. 16, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 23/492 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01)
CPC H01L 21/4871 (2013.01) [H01L 23/4922 (2013.01); H01L 25/50 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a module, wherein the method comprises:
providing one or more solder bodies, each solder body made of a solderable material and including a base portion having an elevated rim extending about at least part of a perimeter the base portion such that the base portion and elevated rim together form a cavity; and
for each of the one or more solder bodies, placing a carrier on which at least one electronic component is mounted on the base portion within the cavity, wherein the elevated rim prevents lateral movement of the carrier relative to the base portion.