CPC H01L 21/4846 (2013.01) [H01L 21/0273 (2013.01); H01L 21/0274 (2013.01); H01L 21/0275 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H05K 1/0218 (2013.01); H01L 2224/16225 (2013.01)] | 20 Claims |
1. A microelectronic assembly, comprising:
a substrate;
a first rectilinear conductive trace, having a first thickness and a first width, in the substrate; and
a second rectilinear conductive trace, having a second thickness and a second width, in the substrate, wherein:
the first and second rectilinear conductive traces each have straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
the bottom surface of the second rectilinear conductive trace is coplanar with the bottom surface of the first rectilinear conductive trace;
the first thickness is greater than the second thickness and the first width is greater than the second width;
the first thickness is between 4 microns (um) and 70 um and the second thickness is between 1 um and 35 um;
the first rectilinear conductive trace is electrically coupled to a power plane; and
the second rectilinear conductive trace is electrically coupled to a data signal or a data transmission line.
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