US 11,942,334 B2
Microelectronic assemblies having conductive structures with different thicknesses
Jeremy Ecton, Gilbert, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); Suddhasattwa Nad, Chandler, AZ (US); Kristof Kuwawi Darmawikarta, Chandler, AZ (US); Vahidreza Parichehreh, Gilbert, AZ (US); Veronica Aleman Strong, Hillsboro, OR (US); and Xiaoying Guo, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 21, 2018, as Appl. No. 16/231,181.
Prior Publication US 2020/0205279 A1, Jun. 25, 2020
Int. Cl. H05K 1/02 (2006.01); H01L 21/027 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)
CPC H01L 21/4846 (2013.01) [H01L 21/0273 (2013.01); H01L 21/0274 (2013.01); H01L 21/0275 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H05K 1/0218 (2013.01); H01L 2224/16225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a substrate;
a first rectilinear conductive trace, having a first thickness and a first width, in the substrate; and
a second rectilinear conductive trace, having a second thickness and a second width, in the substrate, wherein:
the first and second rectilinear conductive traces each have straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
the bottom surface of the second rectilinear conductive trace is coplanar with the bottom surface of the first rectilinear conductive trace;
the first thickness is greater than the second thickness and the first width is greater than the second width;
the first thickness is between 4 microns (um) and 70 um and the second thickness is between 1 um and 35 um;
the first rectilinear conductive trace is electrically coupled to a power plane; and
the second rectilinear conductive trace is electrically coupled to a data signal or a data transmission line.