US 11,942,312 B2
Gas analyzer apparatus
Naoki Takahashi, Tokyo (JP); and Prakash Sreedhar Murthy, Tokyo (JP)
Assigned to ATONARP INC., Tokyo (JP)
Filed by ATONARP INC., Tokyo (JP)
Filed on Dec. 14, 2022, as Appl. No. 18/065,656.
Application 18/065,656 is a continuation of application No. 17/417,581, granted, now 11,557,469, previously published as PCT/JP2020/012839, filed on Mar. 24, 2020.
Claims priority of application No. 2019-057148 (JP), filed on Mar. 25, 2019.
Prior Publication US 2023/0187190 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01); H01J 49/10 (2006.01)
CPC H01J 37/32981 (2013.01) [H01J 37/321 (2013.01); H01J 37/32348 (2013.01); H01J 37/32449 (2013.01); H01J 37/32963 (2013.01); H01J 49/105 (2013.01); H01J 2237/057 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A processing system comprising:
a processing chamber in which a plasma process for manufacturing a product is carried out;
a gas analyzer apparatus to which a sample gas is supplied from the processing chamber;
a gas inlet path configured to introduce only a gas in the processing chamber to the gas analyzer apparatus via a flow control valve to control a flow of the gas from the processing chamber;
an exhaust system for evacuating the sample gas through the gas analyzer; and
a process controller that controls the at least one plasma process for manufacturing a product carried out in the processing chamber based on a measurement result of the gas analyzer apparatus.