US 11,942,273 B2
Electronic component
Satoshi Yokomizo, Nagaokakyo (JP); Shinobu Chikuma, Nagaokakyo (JP); and Yohei Mukobata, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on May 25, 2022, as Appl. No. 17/752,899.
Claims priority of application No. 2021-091540 (JP), filed on May 31, 2021.
Prior Publication US 2022/0384098 A1, Dec. 1, 2022
Int. Cl. H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01)
CPC H01G 2/065 (2013.01) [H01G 4/008 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 2/06 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component comprising:
an electronic element; and
an interposer board; wherein
the electronic element includes:
a rectangular or substantially rectangular multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces; and
external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers;
the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces;
one of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surface in a vicinity of the interposer board;
the interposer board is an alumina board;
at least one notch is provided in end regions each including one of the pair of board end surfaces, one of the pair of board side surfaces in the vicinity of the one of the pair of board end surfaces, one of the pair of board main surfaces in the vicinity of the one of the pair of board end surfaces, a ridge portion between the one of the pair of board end surfaces and the one of the pair of board side surfaces, a ridge portion between the one of the pair of board end surfaces and the one of the pair of board main surfaces, a ridge portion between the one of the pair of board side surfaces and the one of the pair of board main surfaces, and a corner portion between the one of the pair of board end surfaces, the one of the pair of board side surfaces, and the one of the pair of board main surfaces; and
the at least one notch is not exposed from a surface of the interposer board.