CPC H01F 27/29 (2013.01) [H01F 27/022 (2013.01); H01F 27/24 (2013.01); H01L 25/16 (2013.01); H01L 28/10 (2013.01)] | 20 Claims |
1. A package device, comprising:
a) a package body having a support body and an encapsulating body configured to encapsulate a conductive body of the package device;
b) at least one extraction electrode electrically connected to the conductive body, and having a part exposed outside the package body;
c) wherein the support body is located on only part of a bottom surface of the encapsulating body, and protrudes from the bottom surface of the encapsulating body to form a cavity defined by the remaining exposed bottom surface of the encapsulating body and inner side surface of the supporting body; and
d) wherein the bottom surface of the support body is provided with a groove portion, the groove portion is substantially centered in an outer side surface of the support body to which the cavity does not extend, a part of the extraction electrode is buckled in the groove portion, and a width of the groove portion is greater than a width of the part of the extraction electrode, wherein the groove portion does not extend into the cavity.
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