US 11,942,263 B2
Supportable package device and package assembly
Jian Wei, Hangzhou (CN); and Ke Dai, Hangzhou (CN)
Assigned to Silergy Semiconductor Technology (Hangzhou) LTD, Hangzhou (CN)
Filed by Silergy Semiconductor Technology (Hangzhou) LTD, Hangzhou (CN)
Filed on Nov. 4, 2019, as Appl. No. 16/672,698.
Claims priority of application No. 201811337563.4 (CN), filed on Nov. 12, 2018.
Prior Publication US 2020/0152372 A1, May 14, 2020
Int. Cl. H01F 27/29 (2006.01); H01F 27/02 (2006.01); H01F 27/24 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01)
CPC H01F 27/29 (2013.01) [H01F 27/022 (2013.01); H01F 27/24 (2013.01); H01L 25/16 (2013.01); H01L 28/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package device, comprising:
a) a package body having a support body and an encapsulating body configured to encapsulate a conductive body of the package device;
b) at least one extraction electrode electrically connected to the conductive body, and having a part exposed outside the package body;
c) wherein the support body is located on only part of a bottom surface of the encapsulating body, and protrudes from the bottom surface of the encapsulating body to form a cavity defined by the remaining exposed bottom surface of the encapsulating body and inner side surface of the supporting body; and
d) wherein the bottom surface of the support body is provided with a groove portion, the groove portion is substantially centered in an outer side surface of the support body to which the cavity does not extend, a part of the extraction electrode is buckled in the groove portion, and a width of the groove portion is greater than a width of the part of the extraction electrode, wherein the groove portion does not extend into the cavity.