US 11,942,240 B2
Distribution member and method of manufacturing the same
Kenichi Egami, Tokyo (JP)
Assigned to Proterial, Ltd., Tokyo (JP)
Filed by Hitachi Metals, Ltd., Tokyo (JP)
Filed on Nov. 4, 2021, as Appl. No. 17/519,206.
Application 17/519,206 is a continuation of application No. 17/070,019, filed on Oct. 14, 2020, granted, now 11,189,395.
Application 17/070,019 is a continuation of application No. 16/742,155, filed on Jan. 14, 2020, granted, now 10,832,831, issued on Nov. 10, 2020.
Application 16/742,155 is a continuation of application No. 15/979,696, filed on May 15, 2018, granted, now 10,580,550, issued on Mar. 3, 2020.
Claims priority of application No. 2017-108504 (JP), filed on May 31, 2017.
Prior Publication US 2022/0059252 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01B 7/00 (2006.01); H01B 7/40 (2006.01); H01B 13/012 (2006.01); H01B 17/60 (2006.01); H01R 43/24 (2006.01); H02K 3/38 (2006.01); H02K 3/50 (2006.01)
CPC H01B 7/0045 (2013.01) [H01B 7/40 (2013.01); H01B 13/01209 (2013.01); H01B 17/60 (2013.01); H01R 43/24 (2013.01); H02K 3/50 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A wiring structure, comprising:
two electric wires;
a first holder comprising a first interposed part being provided between the two electric wires;
a second holder comprising a second interposed part being separated from the first holder and provided between the two electric wires; and
a combining part connecting between the first holder and the second holder and being located between the two electric wires,
wherein the first holder, the second holder, and the combining part are provided integrally, and
wherein the two electric wires in the first holder are covered with a first resin mold part comprising a molding resin and the two electric wires in the second holder are covered with a second resin mold part being separated from the first resin mold part and comprising a molding resin, while the two electric wires in the combining part are not covered with a molding resin.