US 11,941,476 B2
Contactless communication medium and method for producing contactless communication medium
Aki Nakano, Tokyo (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Appl. No. 17/638,279
Filed by SONY GROUP CORPORATION, Tokyo (JP)
PCT Filed Jul. 20, 2020, PCT No. PCT/JP2020/028006
§ 371(c)(1), (2) Date Feb. 25, 2022,
PCT Pub. No. WO2021/044748, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 2019-161844 (JP), filed on Sep. 5, 2019.
Prior Publication US 2022/0327296 A1, Oct. 13, 2022
Int. Cl. G06K 7/10 (2006.01); B32B 3/30 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); A47G 29/10 (2006.01)
CPC G06K 7/10297 (2013.01) [B32B 3/30 (2013.01); B32B 27/308 (2013.01); B32B 27/365 (2013.01); A47G 29/10 (2013.01); B32B 2307/412 (2013.01); B32B 2519/02 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A contactless communication medium, comprising:
an integrated circuit (IC) module used to perform a contactless communication;
a first member that is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface;
a second member that is made of a second transparent resin material, the second member being connected to the first surface or the second surface;
a print layer that is arranged between the first member and the second member; and
a lid member that is arranged to cover the concave portion accommodating therein the IC module.