US 11,941,270 B2
Data storage device with die-based enhanced thermal management
Niles Yang, Mountain View, CA (US)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Apr. 4, 2022, as Appl. No. 17/713,126.
Prior Publication US 2023/0315314 A1, Oct. 5, 2023
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0634 (2013.01) [G06F 3/0604 (2013.01); G06F 3/0653 (2013.01); G06F 3/0679 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A data storage device, comprising:
a non-volatile memory device including a plurality of memory dies, wherein each of the plurality of memory dies include;
a controller configured to:
poll each of the plurality of memory dies at a first predetermined rate for a thermal status bit;
determine whether the thermal status bit of at least one memory die of the plurality of memory dies is an active thermal status bit;
reduce an operating performance of the at least one memory die in response to determining that the thermal status bit of the at least one memory die of the plurality of memory dies is the active thermal status bit;
poll the at least one memory die at a second predetermined rate; and
determine whether the thermal status bit of the at least one memory die of the plurality of memory dies is not the active thermal status bit.