US 11,940,936 B2
Coordinating operations of multiple communication chips via local hub device
Helena Deirdre O'Shea, San Jose, CA (US); Matthias Sauer, San Jose, CA (US); Jorge L. Rivera Espinoza, San Jose, CA (US); and Bernd Adler, San Jose, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jul. 30, 2021, as Appl. No. 17/390,409.
Application 17/390,409 is a continuation of application No. 16/885,935, filed on May 28, 2020, granted, now 11,106,612.
Claims priority of provisional application 62/903,578, filed on Sep. 20, 2019.
Prior Publication US 2021/0357343 A1, Nov. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 13/36 (2006.01)
CPC G06F 13/36 (2013.01) [G06F 2213/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) chip in an electronic device, comprising:
a first interface circuit configured to communicate over a multi-drop bus;
a communication subsystem configured to implement a communication protocol with another electronic device; and
a processor circuit configured to:
receive, via the multi-drop bus, an operation policy representing problematic scenarios of operating combinations in the IC chip and one or more other IC chips and rules for resolving the problematic scenarios,
deploy the received operation policy in the communication subsystem,
detect occurrence of one or more of the problematic scenarios, and
modify an operation of the communication subsystem by applying the deployed operation policy to resolve the one or more of the problematic scenarios.