CPC G03F 7/30 (2013.01) [F26B 5/005 (2013.01)] | 19 Claims |
1. A substrate treating apparatus comprising:
a wet treating chamber configured to perform a developing process on a substrate by supplying a developing liquid;
a treating chamber configured to treat the substrate by supplying a treating fluid;
a heat-treating chamber configured to perform a heat-treating process on the substrate; and
a transfer chamber configured to transfer the substrate between the wet treating chamber, the treating chamber, and the heat-treating chamber,
wherein the treating chamber comprises:
a chamber having a treating space therein;
a supply line having a first open/close valve installed thereon and configured to supply the treating fluid to the treating space;
a heater installed on the supply line and configured to heat the treating fluid;
an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and
a controller configured to control the first open/close valve and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on the substrate in the treating space.
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