US 11,940,734 B2
Apparatus and method for treating substrate
Ki Hoon Choi, Cheonan-si (KR); Eung Su Kim, Cheonan-si (KR); Pil Kyun Heo, Hwaseong-si (KR); Jin Yeong Sung, Chungcheongbuk-do (KR); Hae-Won Choi, Daejeon (KR); Anton Koriakin, Cheonan-si (KR); and Joon Ho Won, Suwon-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/726,343.
Prior Publication US 2023/0341779 A1, Oct. 26, 2023
Int. Cl. G03F 7/30 (2006.01); F26B 5/00 (2006.01)
CPC G03F 7/30 (2013.01) [F26B 5/005 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a wet treating chamber configured to perform a developing process on a substrate by supplying a developing liquid;
a treating chamber configured to treat the substrate by supplying a treating fluid;
a heat-treating chamber configured to perform a heat-treating process on the substrate; and
a transfer chamber configured to transfer the substrate between the wet treating chamber, the treating chamber, and the heat-treating chamber,
wherein the treating chamber comprises:
a chamber having a treating space therein;
a supply line having a first open/close valve installed thereon and configured to supply the treating fluid to the treating space;
a heater installed on the supply line and configured to heat the treating fluid;
an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and
a controller configured to control the first open/close valve and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on the substrate in the treating space.