US 11,940,661 B2
Split enclosure for fan-less cooling
Joseph F. Jacques, Austin, TX (US); Edward John Kliewer, Sunnyvale, CA (US); and Harrison S. Teplitz, Mountain View, CA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Dec. 17, 2021, as Appl. No. 17/554,886.
Prior Publication US 2023/0194810 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01); G02B 6/42 (2006.01); H05K 9/00 (2006.01)
CPC G02B 6/4269 (2013.01) [H05K 7/20127 (2013.01); H05K 7/20518 (2013.01); H05K 9/0058 (2013.01); H05K 9/0015 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus comprising: a device comprising a plurality of components; and a housing that encloses the device, the housing comprising: a first external surface dedicated to cooling a first one of the plurality of components, a second external surface dedicated to cooling a second one of the plurality of components, and a joint between the first external surface and the second external surface, wherein the joint is electrically conductive and thermally resistive, wherein the joint comprises: a flange wherein the flange comprises a plurality of perforations and wherein the plurality of perforations are offset from an air gap between the first external surface and the second external surface; and a gasket.