US 11,940,609 B2
Image conversion module with a microelectromechanical optical system and method for applying the same
Alexander Gaiduk, Jena (DE); Jin Young Sohn, Fullerton, CA (US); Gyoungil Cho, Fullerton, CA (US); and Cheong Soo Seo, Brea, CA (US)
Assigned to CARL ZEISS MICROSCOPY GMBH, Jena (DE); SD OPTICS, INC., Seoul (KR); and STEREO DISPLAY, INC, Anaheim, CA (US)
Filed by Carl Zeiss Microscopy GmbH, Jena (DE); SD Optics, Inc., Seocho-gu (KR); and Stereo Display, Inc., Anaheim, CA (US)
Filed on Oct. 30, 2020, as Appl. No. 17/084,812.
Claims priority of application No. 19206199 (EP), filed on Oct. 30, 2019.
Prior Publication US 2021/0132356 A1, May 6, 2021
Int. Cl. G02B 21/12 (2006.01); G02B 21/00 (2006.01); G02B 26/08 (2006.01)
CPC G02B 21/125 (2013.01) [G02B 21/0032 (2013.01); G02B 26/0833 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An image conversion module, comprising:
an optical interface for establishing an optical path of the image conversion module;
a beam splitting element on the optical path, wherein the beam splitting element is configured for splitting a beam entering the optical interface on the optical path into a first optical subpath and a second optical subpath;
a first exchangeable optoelectronic submodule with an image sensor;
a microelectromechanical optical system that is configured for enhancing a depth of field on the first optical subpath that is directed to the first exchangeable optoelectronic submodule; and
a second exchangeable optoelectronic submodule that comprises an electronic sensor on the second optical subpath, wherein the second exchangeable optoelectronic submodule is configured for acquiring additional data on the sample, wherein the electronic sensor of the second exchangeable optoelectronic submodule is an additional image sensor, or the electronic sensor of the second exchangeable optoelectronic submodule is configured for measuring geometric properties of the sample, or the electronic sensor of the second exchangeable optoelectronic submodule is configured for detecting a feature of the sample, wherein the additional image sensor of the second exchangeable optoelectronic submodule is a polarization image sensor, a hyperspectral image sensor, or a thermal image sensor.