CPC G02B 21/125 (2013.01) [G02B 21/0032 (2013.01); G02B 26/0833 (2013.01)] | 9 Claims |
1. An image conversion module, comprising:
an optical interface for establishing an optical path of the image conversion module;
a beam splitting element on the optical path, wherein the beam splitting element is configured for splitting a beam entering the optical interface on the optical path into a first optical subpath and a second optical subpath;
a first exchangeable optoelectronic submodule with an image sensor;
a microelectromechanical optical system that is configured for enhancing a depth of field on the first optical subpath that is directed to the first exchangeable optoelectronic submodule; and
a second exchangeable optoelectronic submodule that comprises an electronic sensor on the second optical subpath, wherein the second exchangeable optoelectronic submodule is configured for acquiring additional data on the sample, wherein the electronic sensor of the second exchangeable optoelectronic submodule is an additional image sensor, or the electronic sensor of the second exchangeable optoelectronic submodule is configured for measuring geometric properties of the sample, or the electronic sensor of the second exchangeable optoelectronic submodule is configured for detecting a feature of the sample, wherein the additional image sensor of the second exchangeable optoelectronic submodule is a polarization image sensor, a hyperspectral image sensor, or a thermal image sensor.
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