US 11,940,331 B2
Packages for wireless temperature sensor nodes
Charles D. Smitherman, Greensboro, NC (US); Michael J. Flaherty, Halifax, MA (US); and Eugene Oh Hwang, Melrose, MA (US)
Assigned to Analog Devices, Inc., Wilmington, MA (US)
Filed by Analog Devices, Inc., Norwood, MA (US)
Filed on Sep. 18, 2020, as Appl. No. 17/026,094.
Claims priority of provisional application 62/970,560, filed on Feb. 5, 2020.
Prior Publication US 2021/0239539 A1, Aug. 5, 2021
Int. Cl. G01K 1/18 (2006.01); G01K 1/024 (2021.01); G01K 1/08 (2021.01)
CPC G01K 1/18 (2013.01) [G01K 1/024 (2013.01); G01K 1/08 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A package for a wireless temperature sensor node, the package comprising:
a circuit board;
a temperature sensor disposed on the circuit board;
an antenna electrically coupled to the temperature sensor, wherein the temperature sensor is disposed on a first side of the circuit board and the antenna is disposed on a second side, opposite the first side, of the circuit board;
an electrically transparent lid, wherein the first side of the circuit board faces away from the electrically transparent lid and the second side of the circuit board faces towards the electrically transparent lid; and
a thermally conductive support,
wherein:
the thermally conductive support is in thermal contact with the temperature sensor and
the thermally conductive support is thermally conductively decoupled from the circuit board.