US 11,940,231 B2
Heat dissipation device
Jing Zhang, Zhongshan (CN); and Genglin Ding, Zhongshan (CN)
Assigned to GUANGDONG ENVICOOL TECHNOLOGY CO., LTD., Zhongshan (CN)
Filed by Guangdong Envicool Technology Co., Ltd., Zhongshan (CN)
Filed on Feb. 25, 2022, as Appl. No. 17/680,306.
Claims priority of application No. 202120561499.9 (CN), filed on Mar. 18, 2021.
Prior Publication US 2022/0299274 A1, Sep. 22, 2022
Int. Cl. F28F 1/12 (2006.01); F28F 1/30 (2006.01)
CPC F28F 1/12 (2013.01) 18 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
a heat absorbing member configured to absorb heat from a heat source, the heat absorbing member being provided with a first accommodating chamber for accommodating a phase change working medium and a mounting hole in communication with the first accommodating chamber;
a heat dissipating member connected to the heat absorbing member;
a cover plate arranged at an end of the heat dissipating member away from the heat absorbing member;
heat dissipating fins connected to the heat dissipating member and stacked between the heat absorbing member and the cover plate with an interval such that the heat dissipating member is capable of transferring heat from the heat absorbing member to the heat dissipating fins, the fins being parallel to the cover plate; and
a valve installed in the mounting hole of the heat absorbing member, the valve being adjustable between a first state and a second state to cause the first accommodating chamber to change between a closed state and an open state;
wherein when the first accommodating chamber is in the open state, the first accommodating chamber is in fluid communication with outside the first accommodating chamber so that the phase change working medium can be injected into or discharged from the first accommodating chamber,
wherein a passage in fluid communication with the first accommodating chamber is provided inside the heat dissipating member;
wherein an end of the heat dissipating member close to the first accommodating chamber is provided with a guide channel which is in fluid communication with the first accommodating chamber and the passage; and
wherein the end of the heat dissipating member close to the first accommodating chamber has a reduced thickness such that an inner size of the passage at the guide channel is greater than that of the passage at other portions.