CPC E04B 1/8409 (2013.01) [B32B 9/06 (2013.01); B32B 37/12 (2013.01); B32B 37/14 (2013.01); B32B 38/10 (2013.01); E04B 1/86 (2013.01); G10K 11/168 (2013.01); B32B 2307/102 (2013.01); B32B 2315/18 (2013.01); B32B 2607/00 (2013.01); E04B 2001/8461 (2013.01); F16B 11/006 (2013.01)] | 20 Claims |
1. A method of forming a sound damping wallboard, the method comprising the steps of:
providing a first gypsum layer having a first side wherein the first side includes a first gypsum surface portion and is partly covered with a first encasing layer to provide a first encasing layer portion;
providing a second gypsum layer having a second side wherein the second side includes a second gypsum surface portion and is partly covered with a second encasing layer to provide a second encasing layer portion;
applying a sound damping layer on the first side to cover at least part of the first encasing layer portion and the first gypsum surface portion and/or applying a sound damping layer on the second side to cover at least part of the second encasing layer portion and the second gypsum surface portion; and
positioning the first side of the first gypsum layer to the second side of the second gypsum layer.
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