US 11,939,677 B2
Coated metal alloy substrate with at least one chamfered edge and process for production thereof
Kuan-Ting Wu, Taipei (TW); Chi Hao Chang, Taipei (TW); and Hsing-Hung Hsieh, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/297,210
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jun. 11, 2019, PCT No. PCT/US2019/036485
§ 371(c)(1), (2) Date May 26, 2021,
PCT Pub. No. WO2020/251548, PCT Pub. Date Dec. 17, 2020.
Prior Publication US 2022/0112607 A1, Apr. 14, 2022
Int. Cl. C23C 22/57 (2006.01); C09D 5/44 (2006.01); C23C 22/78 (2006.01); C25D 13/12 (2006.01)
CPC C23C 22/57 (2013.01) [C09D 5/4411 (2013.01); C09D 5/4419 (2013.01); C23C 22/78 (2013.01); C25D 13/12 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A coated metal alloy substrate for an electronic device, wherein the coated metal alloy substrate comprises a metal alloy substrate and at least one chamfered edge and further comprises:
a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate;
a passivation layer deposited on the at least one chamfered edge; and
a water based paint layer deposited on the passivation layer, wherein portions of a lateral surface of the hydrophobic anti-fingerprint layer opposite from the metal alloy substrate are free of the passivation layer and the water based paint layer.