US 11,939,667 B2
Method for manufacturing wavelength conversion member and light emitting device
Naoki Eboshi, Tokushima (JP); Hiroaki Yuto, Awa (JP); Hiroki Sakata, Tokushima (JP); Toshiaki Yamashita, Komatsushima (JP); and Akinori Hara, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Apr. 14, 2021, as Appl. No. 17/230,763.
Claims priority of application No. 2020-079287 (JP), filed on Apr. 28, 2020.
Prior Publication US 2021/0332475 A1, Oct. 28, 2021
Int. Cl. C23C 14/14 (2006.01); C23C 14/58 (2006.01); C23C 16/01 (2006.01); F21V 7/26 (2018.01); F21V 9/32 (2018.01); H01S 5/0225 (2021.01); F21Y 115/10 (2016.01); F21Y 115/30 (2016.01)
CPC C23C 14/5873 (2013.01) [C23C 14/14 (2013.01); C23C 14/588 (2013.01); C23C 16/01 (2013.01); F21V 7/26 (2018.02); F21V 9/32 (2018.02); H01S 5/0225 (2021.01); F21Y 2115/10 (2016.08); F21Y 2115/30 (2016.08)] 17 Claims
OG exemplary drawing
 
1. A method for manufacturing a wavelength conversion member, comprising:
providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface;
forming a light-blocking film on the upper surface of the wavelength conversion layer; and
removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.